Ti/WSi/Ni ohmic contact to n-type SiCN

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Ti/WSi/Ni contact to n-type SiCN was investigated using the circular transmission line method.Current -voltage characteristics,X-ray diffraction and X-ray photoelectron spectroscopy were used to characterize the contacts before and after annealing.It is shown that the conducting behavior of the contacts is dependent on the annealing temperature.After annealing at 900℃or above,ohmic contacts with specific contact resistivity were achieved.The 1000-℃-annealed contact exhibits the lowest specific contact of 3.07×10~(-5)Ω·cm~2.The formation of ohmic contact with low specific contact resistivity was discussed. Ti / WSi / Ni contact to n-type SiCN was investigated using the circular transmission line method. Current-voltage characteristics, X-ray diffraction and X-ray photoelectron spectroscopy were used to characterize the contacts before and after annealing. It is shown that the conducting behavior of the contacts is dependent on the annealing temperature. After annealing at 900 ° C or above, ohmic contacts with specific contact resistivity were achieved. 1000- ° C -annealed contact exhibits the lowest specific contact of 3.07 × 10 -5 ) Ω · cm ~ 2. The formation of ohmic contact with low specific contact resistivity was discussed.
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