研究了pH值对石英玻璃抛光性能的影响,采用动态光散射及Zeta电位对化学机械抛光(CMP)使用的硅溶胶进行分析表征,采用原子力显微镜(AFM)对抛光后石英玻璃表面形貌进行了分析.对pH值作用范围的研究表明,仅用去离子水进行抛光,石英玻璃去除速率几乎为0;在酸性环境里,随着pH值由6降低至4,石英玻璃去除速率增大,可能是由于磨料粒径增大引起的;而在碱性环境里,随着pH值增大,OH-浓度增大,导致石英玻璃溶解度增大,去除速率加快;在石英玻璃的抛光过程中,硅溶胶的机械作用对石英玻璃去除速率有至关重要的影响;另外,抛光液中添加助溶剂碳酸胍进一步提高了石英玻璃表面质量和去除速率,并研究了其去除机理.“,”The effect of the pH value on polishing performances of a fused silica glass was investigated.The colloidal silica used for chemical mechanical polishing (CMP) was analyzed and characterized by the dynamic light scattering (DLS) and Zeta potential (ZP).The surface morphology of the polished fused silica glass was analyzed by the atomic force microscope (AFM).The results show that the removal rate of the fused silica glass polished with just deionized water is almost zero through the research on the action range of the pH value.In acidic region,as the pH value decreases from 6 to 4,the removal rate of the fused silica glass increases,which maybe resulted by the increase of the abrasive size.While in the alkaline region,the OH-concentration increases with the increase of the pH value,thus the solubility of the fused silica glass is enhanced and then the removal rate increases.During the polishing process of the fused silica glass,the mechanical effect of the colloidal silica plays a significant role in enhancing the removal rate of the fused silica glass.Moreover,the addition of the guanidine carbonate (GC) into the slurry can further improve the surface quality and removal rate of the fused silica glass.The corresponding polishing mechanism was proposed.