论文部分内容阅读
为解决大功率光电芯片散热问题,构造了一种新结构一体化平板热管。利用超轻多孔泡沫金属作为毛细吸液芯,以水、丙酮和乙醇为工质,在不同充液比、加热功率和倾角条件下对新结构热管的热性能进行了研究,结果表明,这种新结构平板热管不仅消除了热管与散热片间的接触热阻,而且使整个散热翅片也处于均温状态,当功率达到380W、热流密度超过445 W/cm2时,热管仍具有较好的均温特性,且热阻较小,可达0.04℃/W。在3种工质中,水是最佳工质选择,且当充液比为30%时具有较好的效果。实验表明,以泡沫金属为吸液芯的新结构一体化平板热管具有很好的传热性能,并扩展了承载大热流密度的能力。
In order to solve the problem of heat dissipation of high-power optoelectronic chip, a new structure integrated flat heat pipe is constructed. The superfine porous metal foam was used as capillary wick to study the thermal properties of the new structural heat pipe with water, acetone and ethanol as working fluid at different filling ratio, heating power and dip angle. The results show that this The new structure of the flat heat pipe not only eliminates the thermal contact between the heat pipe and the heat sink, but also the entire fin is also in a state of average temperature, when the power reaches 380W, heat flux density exceeds 445 W / cm2, the heat pipe still has better Temperature characteristics, and thermal resistance smaller, up to 0.04 ℃ / W. Among the three working fluids, water is the best choice for working fluid and has a good effect when the filling ratio is 30%. Experiments show that the new structurally integrated flat heat pipe with foam metal as the wick has good heat transfer performance and expands the ability to carry large heat flux density.