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电子元器件引线的可焊性直接关系到电子产品的可靠性、使用寿命及生产成本。电子工业部科技司为提高引线可焊性组织了三年多技术攻关,引起了广大科技工作者、引线生产厂和电镀工作者的高度重视。大大提高了引线的可焊性。有些引线生产厂的可焊性指标已达到了国外某些企业同类产品的水平。我厂的镀锡铜线是82年试制,83年初投入批量生产的。由于在工艺控制、生产管理和质量管理中注意把可焊性指标作为引线最主要的技术指标进行严格控制,在几年来大量的随机抽样、入库和发货
Solderability of electronic components lead directly related to the reliability of electronic products, service life and production costs. Ministry of Electronics Industry Ministry of Science and Technology to improve the lead solderability organized more than three years of technical research and has attracted the majority of science and technology workers, lead production plant and electroplating workers attach great importance. Greatly improve the solderability of the lead. Some lead manufacturers weldability indicators have reached the level of similar foreign products of some enterprises. Our tin-plated copper wire is 82 trial production, put into mass production in early 83. As the process control, production management and quality management attention to the solderability index as the lead of the most important technical indicators to strictly control the past few years, a large number of random sampling, storage and delivery