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对约400μm厚的低温共烧陶瓷流延片进行准分子激光微孔加工工艺实验研究。由于低温共烧陶瓷流延片黏结性强并且微孔结构较小,提出了采用X光显微成像测试的方法对微孔内部结构轮廓的检测,对激光微孔加工的孔腔结构形成进行了分析研究。研究结果表明,在一定范围内,随着激光打孔脉冲个数的增加及激光能量密度的增大,所获得的微孔的锥度减小;较高能量密度的激光束可以提高对低温共烧陶瓷流延片的激光打孔效率,但过高能量密度的激光束刻蚀材料时对微孔周围的基材产生较强的冲击,易导致微孔结构的破坏,对孔型质量造成严重影响。研究采用的X光显微成像测试技术能够快速获得完整的微孔内腔的轮廓图,对提高激光打孔效率和改善孔型结构质量提供一定的参考意义。
The experiment of excimer laser micropore processing was carried out on the low temperature co-fired ceramic wafers about 400μm thick. Due to the high cohesiveness of the LTCC green sheets and the small pore structure, the method of X-ray microscopic imaging was used to detect the internal structure contour of the micro-pores and the formation of the cavity structure of the laser micro-hole machining Analysis. The results show that the taper of the obtained micropores decreases with the increase of the number of laser drilling pulses and laser energy density within a certain range. The laser beam with higher energy density can improve the co-firing of low temperature However, laser beam etching of ceramic delaminated chips has a strong impact on the substrate around the micropores when the laser beam is too high in energy density, which may easily lead to the destruction of the microporous structure and seriously affect the quality of the meshes . The X-ray microscopic imaging technology used in the research can quickly obtain the contour of the micropore cavity and provide some reference significance for improving the laser drilling efficiency and improving the quality of the hole structure.