激光电路板直写技术避免了传统化学沉积方法高昂的价格与环境的污染,也同时大大增加了电路设计的灵活性。重点研究聚合物金属粉掺杂材料的激光电路直写,使用不同参数的激光束对样本表面活化处理后采用同一的方式进行化学沉积,测试了激光电路板直写中激光参数对结果的影响。最后采用SEM对材料表面微观形貌及电阻值进行观察,发现在一定的功率与光斑覆盖率下,通过优化加工参数可获得最佳导通率和表面平整度。 Laser direct write technology to avoid the traditional chemical deposition method of high price and environmental pollution, but also greatly increased the flexibility of circuit design. Focusing on the direct writing of the laser circuit of the polymer metal powder doped material, the same method was used for the chemical deposition after the sample surface activation treatment by using different parameters of the laser beam, and the influence of the laser parameters on the result in the direct writing of the laser circuit board was tested. Finally, SEM was used to observe the microstructure and resistance of the material surface. It was found that under certain power and spot coverage, the best conductivity and surface roughness can be obtained by optimizing the processing parameters.