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据报导,中国台湾地区晶圆代工大厂台积电(Taiwan SemiconductorManufacturing Co.Ltd.,TSMC)近期表示,公司计划于2007年4月在新竹动工修建第三座300mm晶圆厂,并预期在动工18个月后实现生产,公司正在向新竹科学园区管委会申请新晶圆厂的建筑用地。TSMC第一座300mm晶圆厂建在新竹
Taiwan Semiconductor Manufacturing Co. (TSMC) reportedly said recently that it plans to start construction of its third 300mm wafer fab in Hsinchu in April 2007 and expects to start construction at 18 After months of production, the company is applying to the management committee of Hsinchu Science Park for the construction site of the new wafer fab. TSMC first 300mm foundry in Hsinchu