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东芝开发出了采用晶圆级工艺组装0603尺寸芯片型部件的封装技术。通过一次性组装多个部件,可使组装时花费的成本比采用逐一组装方式的原技术降低一半。东芝生产技术中心和东芝半导体在“第19届微电子研讨会”上就该技术发表了演讲。该公司目前正在生产0603芯片部件——手机ESD(
Toshiba has developed a package technology that uses 0603-size chip components using wafer-level processes. By assembling more than one part at a time, the cost of assembly can be reduced by half as compared to the original technology, which is assembled one by one. Toshiba Production Technology Center and Toshiba Semiconductor delivered a speech on the technology at the 19th Microelectronics Symposium. The company is currently producing 0603 chip components - mobile phone ESD (