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快速制冷启动所产生的形变应力是对红外焦平面探测器芯片可靠性构成影响的重要方面。采用机械加工结合化学腐蚀的方法对芯片进行减薄以提高其柔韧性,从而减小了由于应力传递产生的像元损伤所引起的盲元和裂纹。并在不增加杜瓦冷头零件结构的前提下对杜瓦冷头膨胀匹配进行优化以减小芯片形变和应力。通过可靠性试验验证,提高了快速制冷启动下中波320×256红外焦平面探测器组件长期工作的可靠性和稳定性。
The stress caused by rapid cooling start-up is an important aspect of the reliability of infrared focal plane detector chips. The mechanical processing combined with chemical etching method is used to thin the chip to improve its flexibility, so as to reduce the blind element and the crack caused by the pixel damage caused by the stress transmission. Dewar cold head expansion matching is optimized to reduce the chip deformation and stress without increasing the structure of Dewar cold head parts. Through the reliability test verification, the reliability and stability of the long-term operation of the mid-wave 320 × 256 infrared focal plane detector assembly under the quick start of refrigeration are improved.