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以FC倒装芯片振动模型为基础,阐述了利用固有频率变化进行芯片缺陷检测的原理.通过COMSOLMultiphysics软件对周边型FC芯片的前5阶模态进行了仿真分析,结果显示焊点缺失会引起FC芯片高阶固有频率的明显变化.利用基于空气耦合超声激励的FC芯片缺陷检测方法,对焊点缺失FC芯片的振动速度进行了测量,提取出了FC芯片的前5阶固有频率,测量结果与仿真结果一致,验证了该方法检测FC芯片缺陷的可行性.
Based on the FC flip-chip vibration model, the principle of chip defect detection by inherent frequency variation is expounded.The first 5 modes of the peripheral FC chip are simulated by COMSOL Multiphysics software. The results show that the missing solder joint will cause FC The natural frequency of the chip changes significantly.Using the method of FC chip defect detection based on air-coupled ultrasonic excitation, the vibration velocity of the FC chip with missing solder joint is measured and the first 5 natural frequencies of the FC chip are extracted. The simulation results are consistent, verifying the feasibility of detecting FC chip defects by this method.