论文部分内容阅读
高密度塑封器件不同材料间分层断裂常导致器件失效,且界面通常为正应力作用下的张开型(模式I)断裂和切应力作用下的滑开型(模式II)断裂的混合模式。环氧塑封料和Cu引线框架之间热失配较大,在热、力学载荷作用下,环氧/铜界面易发生界面分层断裂。设计了一种双相材料样品和一种可以对样品施加不同角度拉力的装置,用于测试环氧/铜界面混合断裂参数。通过弹性断裂力学分析,基于实验结果可以得到界面断裂能量释放率和混合断裂相位角。该方法可以应用于电子封装中其他界面断裂参数的表征。
Layer delamination between different materials in high-density plastic encapsulation often leads to device failure, and the interface is usually a mixed mode of open (mode I) fracture and shear-slip (mode II) fracture under normal stress. Epoxy plastic material and Cu lead frame thermal mismatch between the larger, thermal and mechanical load, the epoxy / copper interface prone interface layer fracture. A dual-phase material sample and a device that can apply different angular tensile forces to the sample were designed to test the mixed fracture parameters at the epoxy / copper interface. Based on the experimental results, the energy release rate of interface fracture and the phase angle of mixed fracture can be obtained by elastic fracture mechanics analysis. This method can be applied to the characterization of other interface fracture parameters in electronic packaging.