微带线镀金工艺,因图形细小,控制镀层厚度在要求范围内,有一定困难。本文研究采用:以金的电阻率常数作基础,在镀复过程中,采用随时测量和监控方式,来控制镀层厚度,基本上保证了工艺要求。我们认为该方法对其他类似镀件,也有一定参考价值。现将全文发表,供有关同志参阅。 Microstrip line gold plating process, due to the small size of the control coating thickness in the required range, there are some difficulties. In this paper, the study uses: resistivity constants of gold as a basis, in the plating process, the use of ready-to-measure and monitoring methods to control the coating thickness, basically to ensure the process requirements. We think this method has some reference value to other similar plating. The full text is now published for reference by the relevant comrades.