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以双马来酰亚胺树脂(BMI)为树脂基体,二烯丙基双酚A(DABA)为增韧剂,γ-缩水甘油醚氧丙基三甲氧基硅烷(KH-560)表面改性的SiC颗粒-SiC晶须(SiCP-SiCW)为复配导热填料,浇注成型制备SiC_P-SiC_W/BMI导热复合材料,分析研究SiC形状、用量、质量比及表面改性对SiC_P-SiC_W/BMI导热复合材料的导热性能、介电性能、力学性能和热性能的影响。结果表明,当改性SiC_P-SiC_W用量为40wt%且SiC_P∶SiC_W质量比为1∶3时,SiC_P-SiC_W/BMI导热复合材料具有最佳的综合性能,导热系数λ为1.125W(m·K)~(-1),介电常数ε为4.12,5%热失重温度为427℃。
The surface modification of γ-glycidoxypropyltrimethoxysilane (KH-560) with bismaleimide resin (BMI) as resin matrix, diallylbisphenol A (DABA) as toughening agent Of SiC particles-SiC whiskers (SiCP-SiCW) as composite thermal conductive filler, and pouring to prepare SiC_P-SiC_W / BMI thermal conductive composites. The effects of SiC shape, amount, mass ratio and surface modification on the thermal conductivity of SiC_P-SiC_W / BMI The thermal conductivity, dielectric properties, mechanical properties and thermal properties of composites. The results show that SiC_P-SiC_W / BMI composites have the best comprehensive properties when the content of modified SiC_P-SiC_W is 40wt% and the mass ratio of SiC_P:SiC_W is 1: 3. The thermal conductivity λ is 1.125W (m · K ) ~ (-1), the dielectric constant ε is 4.12, the 5% weight loss temperature is 427 ℃.