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在微波混合电路和多芯片模块中,填充孔相比于传统电镀通孔在解决微波接地、芯片散热和微组装工艺问题等方面具有很大优势。利用填充孔工艺使微波电路的设计更加灵活;由于填充孔消除了组装时通孔溢出导电胶或焊料过多的现象,提高了组装工艺效率。对薄膜基板上填充孔的制作工艺进行了深入研究,并对其电参数、散热性能和可靠性进行了测试和评估。最后,将采用填充孔工艺的薄膜基板应用于限幅低噪放和锁相源产品中,测试结果表明产品性能和散热效果均有明显提高。
In microwave hybrid circuits and multi-chip modules, filled holes offer significant advantages over conventional plated through-holes in resolving issues such as microwave grounding, chip cooling, and microassembly process issues. The process of filling the hole makes the design of the microwave circuit more flexible; as the filling hole eliminates the phenomenon that the through hole overflows the conductive adhesive or solder when assembling, the assembly process efficiency is improved. The fabrication process of filled holes on the film substrate has been deeply studied, and its electrical parameters, heat dissipation performance and reliability have been tested and evaluated. Finally, the thin-film substrate with filled hole technology is applied to the products of limiting low-noise amplifier and phase-locked source. The test results show that both the product performance and the heat dissipation effect are obviously improved.