The developments of coated conductor technology have been reviewed. It is shown that the critical current density of high-Tc wires can be greatly enhanced by using three-fold approaches: grain alignment, grain boundary doping, and optimization of the grain architecture. Major advances have been made in the last 16 years mainly in three aspects: substrates, buffer layers and the YBCO layer. Cost is still the main concern for scale up, especially for the approach through vapor depositions, such as the PLD method. TFA-MOD or other CSD methods may be the trend to overcome cost and speed consideration during the scale up. However, high reliability and reproducibility will be the new focus for these techniques. Ni-alloy tapes seem to have advantages over pure Ni in terms of mechanical strength and oxidation resistance. Depositing a pure Ni layer on top of Ni-based alloys (such as Ni-Cr and Ni-W alloys) solves the problem of low strength of Ni and poor texture of Ni alloys. The RABiTS and IBAD are the two robu The developments of coated conductor technology have been reviewed. It shows shown that the critical current density of high-Tc wires can be greatly enhanced by using three-fold approaches: grain alignment, grain boundary doping, and optimization of the grain architecture. have been made in the last 16 years mainly in three aspects: substrates, buffer layers and the YBCO layer. especially in the main concern for scale up, especially for the approach through vapor depositions, such as the PLD method. Other, CSD methods may be the trend to overcome cost and speed consideration during the scale up. However, high reliability and reproducibility will be the new focus for these techniques. oxidation resistance. Depositing a pure Ni layer on top of Ni-based alloys (such as Ni-Cr and Ni-W alloys) solves the problem of low strength of Ni and poor texture of Ni alloys. The RABiTS and IBA D are the two robu