论文部分内容阅读
本文对比了蒸发镀膜过程中基片不移动和基片在正方形区域内做平移运动两种情形的膜厚均匀性特性。计算得出,对于基片不移动情形,基片中心在蒸发源正上方时,膜厚方差取最小值σ_(s-min),而基片做平移运动情形的膜厚方差σ_k比σ_(s-min)还要小。结果表明,基片做平移运动能获得更加好的膜厚均匀性。
In this paper, the uniformity of film thickness in two cases of substrate movement and substrate movement in a square area during evaporation is compared. The calculated film thickness variance takes the minimum value σ s-min when the substrate center is just above the evaporation source, and the film thickness variance σ_k of the substrate in translational motion is smaller than σ s -min) still smaller. The results show that the substrate translational movement can get better film thickness uniformity.