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[会议论文] 作者：Idriss Blakey,Ya-Mi Chuang,Han-Hao Cheng,Imelda Keen,Anguang Yu,Kevin S.Jack,Michael J.Leeson,Todd R.Younkin,
来源：International Conference on Nanoscience & Technology,China 2 年份：2013
Fabrication of ordered nanoseale structures is crucial for the manufacture of integrated circuits (CPUs RAM etc), next generation hard drives and metamaterials.Top down optical lithography techniques...
[会议论文] 作者：Han-Hao Cheng,Imelda Keen,Anguang Yu,Ya-Mi Chuang,Idriss Bla key,Andrew K.Whittaker,Kevin S.Jack,Michael,
来源：Sixth International Symposium On Engineering Plastics (第六届工程 年份：2013
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[会议论文] 作者：Han-Hao Cheng,Imelda Keen,Anguang Yu,Ya-Mi Chuang,Idriss Bla key,Kevin S.Jack,Michael J.Leeson,Todd R.Younkin,
来源：Sixth International Symposium On Engineering Plastics (第六届工程 年份：2013
Extreme ultraviolet lithography (EUVL) is arguably the leading candidate to replace 193 nm immersion double pattering for the high volume manufacture of semiconductor devices at the 32 nm node and bel...
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