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[期刊论文] 作者：Hao Zhang,Qing-Sheng Zhu,Zhi-Quan Liu,Li Zhang,Hongyan Guo,Chi-Ming Lai,,
来源：Journal of Materials Science & Technology 年份：2014
FeeNi films with compositions of Fee75Ni,Fee50Ni,and Fee30Ni were used as under bump metallization(UBM)to evaluate the interfacial reliability of SnAgCu/FeeNi s...
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