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Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag sold
[期刊论文] 作者:SHEN Jun,LIU Yongchang,Han Yajing,GAO Houxiu,
来源:稀有金属(英文版) 年份:2006
A lead-free Sn-3.5Ag solder was prepared by rapid solidification technology. The high solidification rate, obtained by rapid cooling, promotes nucleation, and s...
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