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[会议论文] 作者：T.MINARI,K.SAKAMOTO,T.YASUDA,M.KANEHARA,
来源：10th IUPAC International Conference on Novel Materials and t 年份：2014
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[会议论文] 作者：T.Minari,K.Sakamoto,T.Yasuda,M.Kanehara,
来源：IUPAC 9th International Conference on Novel Materials and th 年份：2013
Printing of semiconductor devices under ambient atmosphere is a promising method for large-area and low-cost fabrication of electronics products [1].We have dev...
[期刊论文] 作者：邱敦莲,K.Sakamoto,等,
来源：国外作物育种 年份：2001
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[会议论文] 作者：H.Shimamoto,K.Omura,H.Harada,K.Tanaka,K.Sakamoto,
来源：19th International Conference on Oral and Maxillofacial Surg 年份：2009
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[会议论文] 作者：K.Sakamoto,A.Imai,N.Ueno,P.E.J.Eriksson,R.I.G.Uhrberg,T.Oda,M.Tsujikawa,A.Kimura,M.Taniguchi,K.Miyamoto,
来源：IUPAC 5th International Symposium on Novel Materials and the 年份：2009
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[会议论文] 作者：K.Sakamoto,P.E.J.Eriksson,R.I.G.Uhrberg,T.Oda,A.Kimura,K.Miyamoto,M.Tsujikawa,A.Imai,N.Ueno,H.Namatame,
来源：IUPAC 5th International Symposium on Novel Materials and the 年份：2009
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