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Unravelling the metal borides evolution in the transient liquid phase bonding of Ni-based alloys via
[期刊论文] 作者：Kewu Bai,Ming Lin,
来源：材料科学技术（英文版） 年份：2021
The understanding of temperature and time-dependent metal borides precipitation/dissolution is cru-cial for the design of the transient liquid phase(TLP)bonding process of Ni-based alloys.It however remains elusive despite substantial resea......
High-throughput development and applications of the compositional mechanical property map of the β t
[期刊论文] 作者：Jinfeng Ling,Dandan Huang,Kewu Bai,Wei Li,Zhentao Yu,Weimin Chen,
来源：材料科学技术（英文版） 年份：2021
By a combination of the nanoindentation and electron probe microanalysis (EPMA) techniques,the traditional diffusion couple technique is extended to map the mec...
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