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[期刊论文] 作者：Bin ZHANG,Qingyuan YU,Jun TAN,,
来源：材料科学技术学报：英文版 年份：2008
200-nm-thick Au interconnects on a quartz substrate were tested in-situ inside a dual-beam microscope by applying direct current,alternating current and alt...
[期刊论文] 作者：Bin ZHANG,Qingyuan YU,Jun TAN,,
来源：材料科学技术学报 年份：2004
200-nm-thick Au interconnects on a quartz substrate were tested in-situ inside a dual-beam microscope by applying direct current,alternating current and alterna...
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