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[期刊论文] 作者：Fu Qiang,Xue Songbai,
来源：中国焊接 年份：2004
The full-bridge zero-voltage and zero-current switching inverter, which can adjust the output power by keeping the duty-cycle of lagging arm constant, changing...
[期刊论文] 作者：ZHANG Liang,XUE Songbai,GAO Li,
来源：中国机械工程学报 年份：2010
SnAgCu solder system with the addition of rare earth Ce,which has better thermo-mechanical properties compared to those of SnPb solder,is regarded as one of the...
Effects of Ga, Al, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free sol
[期刊论文] 作者：WANG Hui,XUE Songbai,ZHAO Feng,
来源：稀有金属：英文版 年份：2009
一个直角的方法被用来在 Sn-9Zn 的弄湿的特征上评估 Ga，艾尔， Ag，和 Ce 多增加的效果无铅由弄湿平衡方法焊接。结果证明 Ga，艾尔， Ag，和 Ce 的最佳的装载分别地是 0.2 wt.% ， 0.002...
Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu sub
[期刊论文] 作者：CHEN Wenxue XUE Songbai WANG H,
来源：稀有金属：英文版 年份：2009
最容易溶解的 Sn-9Zn 合金与 Ag (0 wt.%-1 wt.%) 被做形成 Sn-9Zn-xAg 无铅焊接合金。这合金的微观结构和可焊度上的 Ag 的增加的效果被调查，在 solder/Cu 接口形成的金属间...
[期刊论文] 作者：ZHANG Liang XUE Songbai HAN Zo,
来源：中国机械工程学报 年份：2008
Nonlinear analyses of quad flat package (QFP) on printed circuit board (PCB) assemblies subjected to thermal cycling conditions are presented.Two different...
[期刊论文] 作者：XUE Songbai WU Yuxiu HAN Zongj,
来源：中国机械工程学报 年份：2007
有限元素方法(女性) 被用来在焊接关节的可靠性上分析铅宽度和程度的效果。为 QFP 设备的最佳模拟也被研究。结果显示当铅程度是一样时，焊接关节的最大的相等的压力与增加铅宽...
Effect of Thermal Cycling on Properties and Microstructure of SnAgCuCe Soldered Joints in QFP Device
[期刊论文] 作者：ZHANG Liang,XUE Songbai,GAO Li,
来源：中国机械工程学报 年份：2011
Increasing global concern about the environment is bringing regulatory (European directives) and consumer ('green products') pressure on the electronics...
[期刊论文] 作者：JI Feng XUE Songbai ZHANG Lian,
来源：中国机械工程学报 年份：2011
The solder joint reliability of quad flat non-lead (QFN) package,which has become very popular over the past few years,has received intense interest.The finite...
[期刊论文] 作者：XUE Peng XUE Songbai ZENG Guan,
来源：中国机械工程学报 年份：2011
With the development of lead-free solder alloys, the investiagtion focusing on the relibility of lead-free solders are essential. Since the reliability database...
[期刊论文] 作者：XUE Songbai,ZHANG Liang,HAN Zo,
来源：中国机械工程学报 年份：2011
The laser provides a controllable means of supplying localized energy for solder joint formation and is a valuable tool in electronics manufacture.Diode laser s...
[期刊论文] 作者：Xue Songbai,Qian Yiyu,Zhao Zhe,
来源：中国焊接 年份：2004
The mechanism of interaction relation between the rare-earth element Ce and elements Pb and Bi in Ag-based filler metal has been studied. The results show that...
[期刊论文] 作者：Wang Hui,Xue Songbai,Chen Wenx,
来源：中国焊接 年份：2009
The effects of Ca, Al, and Ag on the anti-oxidation of Sn-9Zn-X solders and the interface reactions between the solders and Cu substrate were investigated by Au...
[期刊论文] 作者：Xue Songbai,Qian Yiyu,Hu Xiaop,
来源：中国焊接 年份：2004
The effects of trace content of Pb and Bi elements on the spreading property and the strength of brazed joints of Ag-Cu-Zn filler metal have been studied. The r...
[期刊论文] 作者：XUE Songbai,WU Yuxiu,HAN Zongj,
来源：机械工程学报（英文版） 年份：2007
The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum Simulation for QFP devic...
[期刊论文] 作者：Lai Zhongmin,Xue Songbai,Lu Fa,
来源：中国焊接 年份：2004
Melting temperature,spreadability,mechanical properties and the microstructures of joints brazed with silver-base filler metals including different amounts of G...
Effects of Ga, Al, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free sol
[期刊论文] 作者：WANG Hui,XUE Songbai,ZHAO Feng,CHEN Wenxue,
来源：稀有金属（英文版） 年份：2009
An orthogonal method was used to evaluate the effects of Ga, AI, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solders by wettin...
Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu sub
[期刊论文] 作者：CHEN Wenxue,XUE Songbai,WANG Hui,WANG Jianxin,HAN Zongjie,
来源：稀有金属（英文版） 年份：2009
The eutectie Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure a...
[期刊论文] 作者：XUE Peng,XUE Songbai,ZENG Guang,ZHANG Liang,DAI Wei,
来源：中国机械工程学报 年份：2011
Abstract:With the development of lead-free solder alloys,the investiagtion focusing on the relibility of lead-free solders are essential.Since the reliability d...
[期刊论文] 作者：Cheng Zhan,Long Weimin,Xue Songbai,Fu Yucan,Wu Mingfang,
来源：中国焊接 年份：2020
Gas pore is a common defect in brazed joint.It lowers the brazing rate and affects the properties of joint.Experimental results show that the application of une...
Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape lea
[期刊论文] 作者：Zhang Liang,Xue Songbai,Lu Fangyan,Han Zongjie,Wang Jianxin,
来源：中国焊接 年份：2004
This paper deals with a study on SnPb and lead-free soldered joint reliability of PLCC devices with different lead counts under three kinds of temperature cycle...
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