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FORMATION AND CHANGE OF AuSn4 COMPOUNDS AT INTERFACE BETWEEN PBGA SOLDER BALL AND Au／Ni／Cu METALLIZA
[期刊论文] 作者：Y.H.Tian C.Q.Wang,
来源：金属学报：英文版 年份：2004
Interactions between 63Sn37Pb solder and PBGA metallization(Au/Ni/Cu)during laser and infrared reflow soldering were studied.During laser refow soldering proces...
EFFECT OF LASER INPUT ENERGY ON AuSnx INTERMETALLIC COMPOUNDS FORMATION IN SOLDER JOINTS WITH DIFFER
[期刊论文] 作者：W.Liu,C.Q.Wang,Y.H.Tian,M.Y.Li,
来源：金属学报（英文版） 年份：2004
Formation of AuSnx intermetallic compounds (IMCs) in laser reflowed solder joints was investigated. The results showed that few IMCs formed at the solder/0.1 μ...
EFFECT OF LASER INPUT ENERGY ON AuSnx INTERMETALLIC COMPOUNDS FORMATION IN SOLDER JOINTS WITH DIFFER
[期刊论文] 作者：W.Liu,C.Q.Wang,Y.H.Tian,M.Y.Li,
来源：金属学报（英文版） 年份：2008
Formation of AuSnx intermetallic compounds (IMCs) in laser reflowed solder joints was investigated. The results showed that few IMCs formed at the solder/0.1 μ...
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