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Growth kinetics of interfacial reaction layer products between cubic boron nitride and Cu-Sn-Ti acti
[期刊论文] 作者：Yonggang Fan,Cong Wang,
来源：材料科学技术（英文版） 年份：2021
In the present investigation,the growth kinetics of interfacial reaction layer products between cubic boron nitride(CBN)and Cu-Sn-Ti filler metal has been thoroughly investigated.Detailed morphological and compositional features of respecti......
Detailing interfacial reaction layer products between cubic boron nitride and Cu-Sn-Ti active filler
[期刊论文] 作者：Yonggang Fan,Junxiang Fan,Cong Wang,
来源：材料科学技术（英文版） 年份：2021
In the present study,we offer an in-depth analysis over the microstructure,thickness and product composition of the interfacial reaction layer generated upon CB...
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