Market needs and LDI Technological improvements Drive further utilization of LDI

来源 :2004春季国际PCB技术/信息论坛 | 被引量 : 0次 | 上传用户:qinggo1
下载到本地 , 更方便阅读
声明 : 本文档内容版权归属内容提供方 , 如果您对本文有版权争议 , 可与客服联系进行内容授权或下架
论文部分内容阅读
Enterprise Engineering - enable companies with several manufacturing facilities to centralize pre production data while still efficiently utilizing different manufacturing capabilities in each individual plant. The economic downturn this industry is experiencing introduced a significant shift from volume to QTA production. Although the overall square footage being produced becomes lower, the number of different parts is increased - shitting workloads from the shop floor to pre production departments. Trying to analyze the pre production challenges, one will probably find that while Tooling (CAM) process turn to maturity, other activities such as sales quotation, and process planning lack in the basics and are the main cause to throughput and quality issues in pre production.
其他文献
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly becoming more critical, fabricators and OEMs must determine the most cost
The European Commission has adopted the RoHS directive(Restriction of the Use of Crtain Hazardous Substances in EEE-2002/95/EC,27th January 2003)The European Commission has adopted the RoHS directive(
本文通过设计并实施不同的试验方案,找到了导致板面镀层不均匀的原因.然后通过对电铜缸的清洗以及对电镀药液的碳处理,基本上解决了板面镀层不均匀和镀层不良两大问题.
Over the past year there has been consistent growth in the use of high Phosphorous - electroless Nickel / immersion Gold (HP - ENIG) as a final finish. The finish is now frequently being used for PBGA
本文从油墨塞孔的工艺方法、塞孔的程度、对位几个方面进行了讨论,对根据用户特殊要求开发的新工艺进行简单的介绍。
The structural integrity of a printed circuit is for the most part dependant upon the adhesive bond between the copper component and the resin glass laminate. A failure mode is normally a delamination
本文主要对高密度、高多层埋盲孔的钻孔问题进行阐述,并主要针对高密度、高多层埋盲孔的钻孔定位方式及钻孔补偿方面进行分析,以便为高密度、高多层埋盲孔的钻孔提供参考。
本文采用LDP1080半固化片为buildup材料,通过设定不同激光钻孔、凹蚀、PTH参数为试验条件,分析影响LDP材料广泛应用的主要因素。
PCB厂的钻孔机好多都是昂贵的进口机器,随着线路板精度要求的提高,钻孔孔偏精度要求越来越接近机器的最高加工精度,很多机器经过长时间的运行以后,机器本身的位置精度即位置度量尺(光栅尺或磁尺)的精度已达不到QA的验收标准,补偿机器精度需请供应商用专用工具(如钢制步距规)、专用方法或购买激光测量仪进行调校,价格十分昂贵且花费时间长。本文阐述我们经过多年的实践,研究摸索出的一条利用公司现有的标准测量仪进行
随着印制线路板外层线路的细密化、精细化,减成法制程已经越来越多被应用于各个PCB厂家,本文从工艺原理、设备、参数控制、操作等方面,介绍我司对于减成法制程的控制方法,希望与各界同仁探讨。