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采用不同结构的硅烷偶联剂(KH550、KH560、KH570)分别对超细蒙脱土进行接枝改性,并利用热失重分析(TGA)、X射线衍射分析(XRD)和扫描电子显微镜(SEM)对其结构性质进行表征,研究结果表明:经KH560接枝的细化蒙脱土层间距最大,其次为经KH550接枝的细化蒙脱土,而经KH570接枝的细化蒙脱土层间距最小。比较而言,经KH560接枝的细化蒙脱土颗粒表面分散片层最多,其次为经KH550接枝的细化蒙脱土,而经KH570接枝的细化蒙脱土表面分散片层最少。
The ultrafine montmorillonites were grafted with silane coupling agents (KH550, KH560 and KH570), respectively. The gravimetric properties of the ultrafine montmorillonites were characterized by TGA, XRD and SEM. The results showed that the graded montmorillonite layers grafted by KH560 had the largest spacing, followed by the graded montmorillonite grafted by KH550, while the graded montmorillonite grafted by KH570 Layer spacing is the smallest. In comparison, the grafted montmorillonite grafted with KH560 had the most dispersed surface layer, followed by the grafted montmorillonite grafted with KH550, while the graded montmorillonite grafted with KH570 had the least dispersed surface layer .