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针对云铜连铸连轧CuAg合金导线的成分,建立了CuAg合金模型,并模拟了其连轧温度条件下CuAg合金中原子的运动规律,结果表明,在云铜所采用的含银800~1000μg/g的CuAg合金导线不会在连铸连轧过程中出现银的团簇现象,说明银不会从CuAg合金中析出形成第二相。SEM、TEM、HRTEM分析结果也表明,云铜连铸连轧的CuAg合金导线在制备加工过程中,第二组元银始终固溶于基体铜中,说明模拟与实验结果相吻合。这种固溶体的显微组织形态也保证了CuAg合金导线性能的稳定。
Aiming at the composition of CuAg alloy wire in YunCu continuous casting and rolling process, a CuAg alloy model was established and the movement of atoms in the CuAg alloy was simulated. The results show that the CuAg alloy containing 800 ~ 1000μg / g of CuAg alloy wire will not appear in the process of continuous casting and rolling silver cluster phenomenon, indicating that silver will not precipitate from the CuAg alloy to form a second phase. The results of SEM, TEM and HRTEM also showed that during the preparation and processing of the CuAg alloy wire of the continuous casting and rolling of the CCB, the second component silver always solid-dissolved in the matrix copper, indicating that the simulation and the experimental results are in good agreement. The microstructure of this solid solution also ensures the stability of CuAg alloy wire performance.