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一、前言众所周知,近几年来半导体工业取得了惊人的进展,现在大规模集成电路已进入大量生产阶段,从计算机、电子交换机等工业生产方面应用的设备直到台式计算机、照相机、手表、汽车等方面得到了广泛的应用。另外,超大规模集成电路的研制也在各方面取得了迅速的进展,正在接近实用阶段。与此同时,一直作为芯片管壳的,与树脂、玻璃同样得到广泛应用的陶瓷材料也有多方面的发展。
I. Preface As we all know, the semiconductor industry has made remarkable progress in recent years. Now that large-scale integrated circuits have entered mass production, the equipment used in industrial production such as computers and electronic switches have been used in desktop computers, cameras, watches, and automobiles. Has been widely used. In addition, the development of very large scale integrated circuits has also made rapid progress in all aspects and is approaching the practical stage. At the same time, ceramic materials, which have been widely used as resin and glass in chip packages, have also been developed in many aspects.