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以单晶α－Ａｌ２Ｏ３陶瓷（蓝宝石）和单晶 Ｃｕ为母材，采用真空扩散焊接获得具有两种不同的界面晶体位向关系的Ｃｕ／Ａｌ２Ｏ３扩散焊接头以及带 Ｎｂ膜中间层的 Ｃｕ／Ｎｂ／Ａｌ２Ｏ３扩散焊接头，研究了界面晶体位向关系对接头断裂能量的影响。结果表明，陶瓷－金属界面的晶体位向关系影响界面粘合功（Ｗａｄ）和断裂过程中金属侧所消耗的塑性变形功（Ｗｐ），从而显著影响接头的断裂能量。界面位向关系为（１００）［０１１］Ｃｕ／／（０００１）［１１２０］Ａｌ２Ｏ３的 Ｃｕ／Ａｌ２Ｏ３接头断裂能量值最低，而具有相同位向关系的带 Ｎｂ膜中间层的 Ｃｕ／Ｎｂ／Ａｌ２Ｏ３接头的断裂能量值则最高。
Using single crystal α-Al2O3 ceramic (sapphire) and single crystal Cu as the base material, Cu / Al2O3 diffusion bonding joint with two different interface crystal orientations and Cu / Nb interlayers with Nb film were obtained by vacuum diffusion welding / Al2O3 diffusion welding head, the influence of the interface orientation on the fracture energy of the joint was studied. The results show that the crystal orientation of the ceramic-metal interface affects the Wad and the plastic deformation work (Wp) consumed by the metal during the fracture process, thus significantly affecting the fracture energy of the joint. (100) [011] Cu // (0001) [1120] The Cu / Al 2 O 3 linker of Al 2 O 3 has the lowest energy at break and the Cu / Nb / Al 2 O 3 linker with Nb film at the same orientation The fracture energy value is the highest.