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聚合物纳米电介质材料由于其出色的机械加工特性、电可调制特性已成为当今高密度封装技术等诸多学科的前沿领域。通过在聚合基体中引入高介电陶瓷或纳米导电颗粒形成具有高介电常数的复合材料,并通过印刷电路板(Printed Circuit Board,PCB)制备工艺内置于PCB基板内部形成埋入式元件(电容、电感及其他无源元件),这已经在电子系统小型化方面显示出巨大的应用前景。文章综述了高介电纳米聚合物复合材料领域近年来的研究进展,探讨了聚合物纳米复合材料在埋入式电容器、电感器中的应用及埋入式无源滤波器的设计方法、制备工艺以及复合材料的电磁特性对埋入式元件电学性能的影响。
Polymer Nano-dielectric Materials Due to its excellent machinability, electrically-tunable properties have become a frontier in many disciplines such as high-density packaging technology today. A composite material with high dielectric constant is formed by introducing high-dielectric ceramic or nano-conductive particles in a polymer matrix, and is embedded in a PCB substrate through a PCB (Printed Circuit Board) preparation process to form a buried component (a capacitor , Inductors and other passive components), which has shown great promise in the miniaturization of electronic systems. In this paper, the research progress of high dielectric nanocomposites in recent years is reviewed. The application of polymer nanocomposites in embedded capacitors and inductors and the design of embedded passive filters are discussed. The preparation process As well as the electromagnetic properties of composite materials on the electrical properties of embedded components.