论文部分内容阅读
本文介绍了一个工作于快照模式的CMOS焦平面读出电路新结构———DCA(Direct injectionChargeAmpli fier)结构 .该结构像素电路仅用 4个MOS管 ,采用特殊的版图设计并用PMOS管做复位管 ,既可保证像素内存储电容足够大 ,又可避免复位电压的阈值损失 ,从而提高了读出电路的电荷处理能力 .由于像素电路非常简单 ,且该结构能有效消除列线寄生电容Cbus的影响 ,因此该结构非常适用于小像素、大规模的焦平面读出电路 .采用DCA结构和 1 2 μm双硅双铝 (DPDM Double PolyDouble Metal)标准CMOS工艺设计了一个 12 8× 12 8规模焦平面读出电路试验芯片 ,其像素尺寸为 5 0× 5 0 μm2 ,电荷处理能力达 11 2pC .本文详细介绍了该读出电路的体系结构、像素电路、探测器模型和工作时序 ,并给出了精确的HSPICE仿真结果和试验芯片测试结果 .
This paper introduces a new structure of CMOS focal plane readout circuit (DCA), which works in snapshot mode. The structure of the pixel circuit is only 4 MOS tubes, using a special layout design and PMOS transistor reset tube , Which can not only ensure that the storage capacitance in the pixel is large enough but also avoid the threshold loss of the reset voltage and thus improve the charge handling capability of the readout circuit.Because the pixel circuit is very simple and the structure can effectively eliminate the influence of the column line parasitic capacitance Cbus , So the structure is very suitable for the small pixel, large-scale focal plane readout circuit.It adopts DCA structure and standard DPM Double PolyDouble Metal CMOS technology to design a 12 8 × 12 8 scale focal plane Read the circuit test chip, the pixel size of 50 × 5 0 μm2, charge handling capacity of 11 2pC.In this paper, the readout circuit architecture, the pixel circuit, the detector model and the working sequence, and gives the Exact HSPICE simulation results and test chip test results.