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概述了全层IVH构造基板“ALIVH”的最新开发动向,它们是母板用途的ALIVH-G和ALIVH-C,半导体封装用途的ALIVH-BG和超薄型ALIVH-F。
Outlines the latest developments in full-layer IVH construction substrates “ALIVH”, ALIVH-G and ALIVH-C for motherboard applications, ALIVH-BG for semiconductor packaging and slim ALIVH-F.