高导热导电的铜和高热阻的钨组成的复合材料在工业中有广泛的应用。然而,不同的膨胀系数使得它们很难共存在一起。解决的办法之一是用它们制造成具有梯度的钨/铜复合材料。用粉末冶金法制备铜钨合金(重量比W∶Cu=80∶20)得到样品,用自动应力仪(DIA)做应力测量和中子衍射确定不同钨/铜梯度复合材料的宏观应力及微应力。结果表明,形变应力可以通过后续的热处理避免,并可大幅地改变微应力;随着铜相衍射线扩大,屈服强度增加,达到300 MPa。 High thermal conductive copper and high thermal resistance of tungsten composite materials in the industry has a wide range of applications. However, different expansion coefficients make it difficult for them to coexist. One of the solutions is to use them to make gradient tungsten / copper composites. The samples were obtained by the powder metallurgy method of Cu - W alloy (weight ratio W: Cu = 80:20). The stress and micro - diffraction of the tungsten / copper gradient composites were determined by using the automatic stress meter (DIA) . The results show that the deformation stress can be avoided by the subsequent heat treatment and the micro-stress can be greatly changed. As the copper-based diffraction line expands, the yield strength increases to 300 MPa.