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按球对称模型分别分析了胶层基体及填充粒子中的微观热应力，同时对经历了不同温差循环的胶层进行了显微观察。取粒子中心为坐标原点时，研究表明，两相材料中各相热应力均在界面达到最大值，降温温差△t1在45℃左右就会引起界面附近胶层开裂。升温会使界面附近胶层屈服，计算出屈服升温温差△t2＝88℃。
According to the spherical symmetry model, the microscopic thermal stresses in the matrix and the filler particles were analyzed respectively. At the same time, the microstructures under different temperature cycles were observed microscopically. When taking the particle center as the origin of coordinates, the research shows that the thermal stress of each phase in the two-phase material reaches the maximum at the interface, and the temperature difference Δ t1 around 45 ℃ will cause the cracking of the glue layer near the interface. Temperature rise will yield near the interface layer, calculated temperature yield yield △ t2 = 88 ℃.