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利用光学和电子显微镜来评价微电子器件中集成电路和外部系统载体之间的电气连接,研究线的结构,焊接处和扩散区的形态,将有助于提高微电子器件的可靠性和寿命。
The use of optical and electron microscopy to evaluate the electrical connections between integrated circuits and external system carriers in microelectronic devices and to study the structure of the wires, the shape of the soldered joints and the diffusion regions will help improve the reliability and longevity of the microelectronic devices.