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介绍一种新型合金材料石墨铝,与传统封装材料进行了比较,表明该材料同时兼有低密度(2.46 g/cm3)、高热导率(200 W/m.K)、与半导体器件热膨胀系数(7×10-6和4×10-6/K)匹配和易加工的特性,且热膨胀系数可以根据需要定制。指出该材料是一种适合大功率器件或单片装配的理想匹配材料,比钨铜、钼铜、可伐等常用材料的密度小几倍,甚至比Al材料密度还低10%。研究表明该种材料的应用可以简化装配程序,降低工艺难度,减轻盒体重量;随着材料生产成本的降低,应用前景广阔。目前国外已经开始在航天、舰船、电子对抗等产品中使用,甚至已经开始应用于汽车领域,应用前景广阔。
A new type of graphitic aluminum alloy is introduced and compared with traditional packaging materials. The results show that the material has both low density (2.46 g / cm3), high thermal conductivity (200 W / mK) and thermal expansion coefficient 10-6 and 4 × 10-6 / K) matching and easy processing characteristics, and thermal expansion coefficient can be customized according to need. It is pointed out that this material is an ideal matching material suitable for high power devices or monolithic assemblies. It is several times smaller than the commonly used materials such as tungsten copper, molybdenum copper and kovar, even 10% lower than the density of Al materials. The research shows that the application of this kind of material can simplify the assembly procedure, reduce the process difficulty and reduce the weight of the box. With the reduction of material production cost, the application prospect is promising. At present, foreign countries have begun to use aerospace, naval ships, electronic warfare and other products, and have even begun to be applied to the automotive field with broad application prospects.