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目前,美国、日本、欧盟始终在LED上游衬底材料、外延片、芯片生产上掌握着领先的专利核心技术,而中国台湾地区通过技术跟踪和规模化发展
At present, the United States, Japan and the EU have always held the leading patented core technologies in the production of LED upstream substrate materials, epitaxial wafers and chips. However, the technology of tracking and large-scale development in Taiwan of China