论文部分内容阅读
HDMI2.0 SOC芯片投入量产在ATE上进行FT测试,Contact测试Fail的不良品很多,导致重测次数增加,生产效率下降,生产计划合格率不达标。通过调整分选机的参数,清除SOC芯片引脚的沾污,插座浮板角落磨损后更换角落PIN,插座探针磨损的调查和验证,最后确定插座探针的设计和材料是导致问题的主要原因。使用新的插座后,大幅度减少了Contact测试不良,提高了生产的良品率,从而提高了生产的效率。
HDMI2.0 SOC chip put into mass production FT test on the ATE, Contact test Fail a lot of bad products, resulting in increased retest times, production efficiency, production planning pass rate is not up to standard. By adjusting the parameters of the sorter to clear the contamination of the SOC chip pins, replace the corner PIN after the socket floating corners are worn out, investigate and verify the wear of the socket probe, and finally determine the design and material of the socket probe which is the major cause of the problem the reason. After using the new socket, the contact test is greatly reduced and the production yield is improved, thereby improving the production efficiency.