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采用AlCl_3-EMIC离子液体在室温下对国产低活性铁素体/马氏体钢(CLAM钢)表面进行镀铝处理。研究了镀前处理对镀层-基体界面的影响。采用SEM、EDS分析了不同电流密度对镀层表面形貌与界面形貌的影响,同时与脉冲电镀所得结果进行了比较。结果表明:在电化学前处理过程中,增大电流密度会增强镀层与基底结合力;电流脉冲的加入可以减弱溶液浓差极化现象,增加表面组织致密性;镀层晶粒大小随电流密度增大而减小,镀层球状组织随电流密度增大而增大。在优化的电镀工艺下(前处理电流密度控制在10 mA/cm~2以上,电镀电流密度控制在10~20 mA/cm~2,对应的电镀时间45~95 min,优选脉冲电流电镀),得到的铝镀层表面光滑,致密,结合力强,厚度可控。
The AlCl_3-EMIC ionic liquid was used to aluminize the surface of domestic low activity ferrite / martensitic steel (CLAM steel) at room temperature. The effect of pre-plating treatment on the coating-substrate interface was studied. The effects of different current density on surface morphology and interface morphology of the coating were analyzed by SEM and EDS. The results were compared with those obtained by pulse plating. The results show that increasing the current density can enhance the adhesion between the coating and the substrate during the electrochemical pretreatment. The current pulse can weaken the phenomenon of concentration-concentration polarization and increase the density of the surface structure. The grain size of the coating increases with the increase of the current density Large and small, coated spherical structure with current density increases. Under the optimal electroplating process (the pretreatment current density is controlled at 10 mA / cm ~ 2, the plating current density is controlled at 10 ~ 20 mA / cm ~ 2, the corresponding electroplating time is 45 ~ 95 min, preferably pulse current plating) The resulting aluminum coating surface is smooth, dense, strong binding, thickness controllable.