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采用自制Sn-3.0Ag-0.5Cu-3.0Bi合金对Si CP/6063Al复合材料进行真空钎焊。通过SEM、EDX实验方法分析钎料与化学镀镍后Si CP/6063Al复合材料真空钎焊接头的显微组织。结果表明:无铅钎料Sn-3.0Ag-0.5Cu-3.0Bi合金显微组织主要由富Sn相、共晶组织和单质Bi构成;其显微组织形成机制可以用化学亲和力来表征,元素间的化学亲和力参数越大,越容易形成化合物;Si Cp/6063Al复合材料真空钎焊后的焊缝组织致密,钎料对镀镍复合材料的润湿性良好;界面生成的IMC为(CuxNi1-x)6Sn5,其晶体结构与Cu6Sn5相似,只是部分Cu原子被Ni取代。
SiCP / 6063Al composites were vacuum brazed with self-made Sn-3.0Ag-0.5Cu-3.0Bi alloy. The microstructure of vacuum brazed joint of Si CP / 6063Al composite after brazing filler metal and electroless nickel plating was analyzed by SEM and EDX. The results show that the microstructure of Sn-3.0Ag-0.5Cu-3.0Bi alloy is mainly composed of Sn-rich phase, eutectic structure and elemental Bi. The microstructure of Sn-3.0Ag-0.5Cu-3.0Bi alloy can be characterized by chemical affinity. (CuxNi1-x) is more likely to form when the chemical affinity parameter is larger. The weld structure of Si Cp / 6063Al composites after vacuum brazing is compact, and the solder wettability to nickel- ) 6Sn5, whose crystal structure is similar to that of Cu6Sn5 except that some of the Cu atoms are replaced by Ni.