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为满足电子封装材料对于热形状稳定性的要求,以对苯二甲酸和丁香酚为原料制备了一种新型环氧树脂单体,并对该单体进行了核磁共振氢谱(1H-NMR)和红外光谱(IR)表征,结果表明,成功制备了目标化合物。随后以聚醚胺类固化剂D230对制备的树脂进行固化,并对固化物进行了热失重(TG)和线膨胀系数(TMA)分析。结果表明,固化后的环氧树脂在90℃以下几乎没有发生膨胀变形,即使在105℃,其线膨胀系数也仅为5%左右,表现出良好的形状稳定性。
In order to meet the requirement of thermal stability of electronic packaging materials, a novel epoxy resin monomer was prepared from terephthalic acid and eugenol. The structure of the monomer was characterized by 1H-NMR, And IR spectroscopy. The results showed that the target compound was successfully prepared. The prepared resin was then cured with polyether amine curing agent D230, and the cured product was subjected to a thermogravimetric analysis (TG) and a linear expansion coefficient (TMA) analysis. The results show that the cured epoxy resin has almost no swelling deformation below 90 ℃, and its linear expansion coefficient is only about 5% even at 105 ℃, showing good shape stability.