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采用真空扩散焊工艺方法 ,对Cu与Al扩散焊接头的组织性能进行了试验研究 ,利用扫描电镜(SEM)、电子探针 (EPMA)、显微硬度等测试方法对焊接过渡区及基体组织和性能进行了分析。试验结果表明 :采用真空扩散焊工艺 ,在加热温度 5 2 0～ 5 40℃ ,保温时间 6 0min ,压力 11.5MPa时 ,在Cu/Al界面处形成明显的扩散过渡区 ,扩散区域宽约 40 μm。在铜侧过渡区中产生金属间化合物 ,会出现显微硬度高峰区 ,控制Al的扩散浓度可避免或减少界面处金属间化合物的产生。
The microstructure and mechanical properties of Cu and Al diffusion bonded joints were investigated by vacuum diffusion welding. The microstructures and mechanical properties of the welded transitional zone and the matrix and the microstructure of the welded joints were investigated by scanning electron microscopy (SEM), electron probe (EPMA) Performance was analyzed. The experimental results show that the diffusion diffusion zone is formed at the interface of Cu / Al with the diffusion temperature of 520 ~ 540 ℃, the holding time of 60 min and the pressure of 11.5 MPa, and the diffusion zone is about 40 μm . Intermetallic compounds are produced in the transition zone of copper, and the peak of microhardness will appear. Controlling the diffusion concentration of Al can avoid or reduce the intermetallic compound formation.