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高可靠固态功率放大器(SSPA)常采用隔离器来实现较好的驻波特性,为保证隔离器联接焊点能够承受上百次温度循环试验和高量级的随机振动试验,常采用Ω桥进行联接。针对隔离器搭桥焊接后驻波特性恶化的问题进行了设计和试验,提出了改善驻波特性的措施,提高了产品可靠性。论述了搭桥状态的匹配电路设计和焊接搭桥工艺的实现方法,满足了电路设计和可靠性设计要求,并对设计方案和可靠性进行了试验验证。试验结果表明,驻波比(VSWR)得到了较大改善,与搭桥前隔离器直接连接微带线的驻波特性一致,通过了100次-55～85℃温度循环试验和加速度总均方根值为207.1 m/s2的随机振动试验,电性能与可靠性满足设计要求。该技术研究成果为提高产品可靠性和隔离器的安装互连提供了设计依据。
High reliable solid state power amplifier (SSPA) often use isolators to achieve better VSWR characteristics. In order to ensure that the isolator joints can withstand hundreds of temperature cycling tests and high-level random vibration tests, often using omega bridge Make the connection. Aiming at the problem of deterioration of standing wave characteristics after isolator bypass welding, the measures to improve the standing wave characteristic are put forward and the reliability of the product is improved. Discusses the design of bridge matching circuit and welding bridge technology, meets the design requirements of circuit design and reliability, and verifies the design scheme and reliability. The experimental results show that the VSWR has been greatly improved, which is consistent with the standing wave characteristics of the microstrip line directly connected to the isolator before bypass, 100 cycles of -55 ~ 85 ℃ and the mean square of acceleration Random vibration test with a root value of 207.1 m / s2 meets the design requirements for electrical performance and reliability. This technical research provides the design basis for improving product reliability and isolator installation and interconnection.