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研究了纳米Al_2O_3颗粒对Sn0.7Cu钎料润湿性的影响,并分析比较了时效0 h和时效250 h后Sn0.7Cu-0.5Al_2O_3/Cu焊点界面IMC的形貌和厚度变化。结果表明:添加微量的纳米Al_2O_3颗粒可以改善Sn0.7Cu钎料的润湿性,但添加过量将降低润湿铺展面积,纳米Al_2O_3颗粒的最佳添加量为0.5%,比Sn0.7Cu钎料的铺展面积提高了30.2%。焊后未时效的焊点钎料晶粒细小,界面处Cu_6Sn_5IMC层较薄,经过150℃时效,钎料晶粒粗化,IMC界面层的厚度明显增加,形貌由扇贝状变为明显的块状,界面的不平度逐步减小。界面层由单一的Cu_6Sn_5IMC层转变为Cu_6Sn_5IMC和Cn_3SnIMC两层,厚度增大了96.5%。
The effects of nano-Al_2O_3 particles on the wettability of Sn0.7Cu solder were studied. The morphology and thickness of SnO.7Cu-0.5Al_2O_3 / Cu solder joints at different temperatures were investigated. The results show that adding a small amount of nano-Al_2O_3 particles can improve the wettability of Sn0.7Cu solder filler, but excessive addition will reduce the wetting spreading area. The optimum addition amount of nano-Al_2O_3 particles is 0.5% Spread area increased by 30.2%. After welding, the solder grains with non-aging solder grains are fine, and the Cu_6Sn_5IMC layer at the interface is thinner. After aging at 150 ℃, the grain size of the solder grains coarsens, the thickness of the IMC interface layer obviously increases, and the morphology changes from scalloped to obvious blocks Shape, the interface of the unevenness gradually reduced. The interface layer changed from a single Cu_6Sn_5IMC layer into two layers of Cu_6Sn_5IMC and Cn_3SnIMC with an increase of 96.5% in thickness.