现场可编程门阵列(FPGA)技术因其提供的设计灵活性,已为系统设计人员广泛采用。非晶硅反熔丝FPGA技术尤其有用,它可以提供一种高电路密度与低功耗,以及非易失性编程和高可靠性的组合。为了充分发挥其可靠性,FPGA厂商需要考虑反熔丝的崩溃(wear-out)机制,并通过一种设计、测试、 Field programmable gate array (FPGA) technology has been widely adopted by system designers for its design flexibility. Amorphous silicon anti-fuse FPGA technology is particularly useful, it can provide a combination of high circuit density and low power consumption, as well as non-volatile programming and high reliability. In order to give full play to its reliability, FPGA vendors need to consider anti-fuse crash (wear-out) mechanism, and through a design, testing,