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本文采用在空间域以加辽金法、在时间域以中心差分法离散的办法,求解了瞬态温度场.介绍了一个解稳态焊接温度场和一个移动热源温度场的算例,并对前者与实测和理论结果作了比较,吻合较好.对于热弹塑性埸,考虑了温度对于材料弹性性质和屈服函数的影响.计算了一个周边固定园板在20℃-200℃-20℃的温度循环下,板内的应力变化和残余应力生成;另一例为一有限板条的热弹塑性分析,其结果可与Boley[4]的分析解对比.
In this paper, the transient temperature field is solved by using the Galerkin method in the spatial domain and by the central difference method in the time domain. An example of the temperature field of a soliton and a temperature field of a mobile heat source is introduced. The former is in good agreement with the measured and theoretical results, and the effect of temperature on the elastic properties and yield function of the material is considered for the thermo-elastic plastic.. In the case of temperature cycling, stress changes and residual stress are generated in the plate. Another example is the thermo-elasto-plastic analysis of a finite strip, which can be compared with the analytic solution of Boley [4].