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以自制的双[4-(4-氨基苯氧基)苯基]砜(BAPS)、4,4′-二氨基二苯醚(ODA)和3,3′,4,4′-二苯醚四甲酸二酐(ODPA)为主要原料,采用共聚法合成了较高黏度的聚酰胺酸(PAA)溶液;然后该PAA溶液经高温酰亚胺化后,制得了TPI(热塑性聚酰亚胺)薄膜。研究结果表明:所有样品均具有较好的尺寸稳定性和较低的吸水率,并具有一定的热塑性;当n(BAPS)∶n(ODA)=50∶50时,相应的TPI薄膜具有相对最好的综合性能,其基本完成了酰亚胺化的转变过程,具有较好的耐热性[玻璃化转变温度(Tg)约为249℃,热失重10%时的温度约为510℃,800℃时的残炭率约为18%]和优异的电绝缘性能(介电常数为2.5、介电损耗为0.001 2和体积电阻率为2.3×10~(13)Ω·m)。
Using homemade bis [4- (4-aminophenoxy) phenyl] sulfone (BAPS), 4,4’-oxydianiline (ODA) and 3,3 ’, 4,4’-diphenyl ether (PAA) solution with high viscosity was prepared by the copolymerization method. The PAA solution was then imidized at high temperature to produce TPI (thermoplastic polyimide) film. The results show that all the samples have good dimensional stability and low water absorption, and have a certain degree of thermoplasticity. When n (BAPS): n (ODA) = 50:50, the corresponding TPI films have the relative maximum Good overall performance, which basically completed the conversion process of imidization, has good heat resistance [glass transition temperature (Tg) of about 249 ℃, 10% of the weight loss when the temperature is about 510 ℃, 800 (About 18% carbon residue) and excellent electrical insulating properties (dielectric constant of 2.5, dielectric loss of 0.001 2 and volume resistivity of 2.3 × 10 13 Ω · m).