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当前半导体制造业快速发展,其目标是具有更快的运行速度,较小的器件尺寸,较大的集成规模以及增加每个单晶硅切片上的元件产量,同时减少次品率来减低制造成本。为了满足这些目标,在整个生产过程中引入元件间的痕量杂质元素会降低芯片的合格率,特定的污染问题可导致不同的半导体器件缺陷。据统计,半导体元件制造业中50%的产率损失是由微量杂质污染导致。所以如何及时有效的控制半导体元件原材料质量问题至关重要。
The current semiconductor manufacturing industry is rapidly evolving with the goal of faster operation, smaller device sizes, larger integration scales, and increased component yields per single-crystal silicon slice while reducing defectives to reduce manufacturing costs . In order to meet these goals, the introduction of trace impurity elements throughout the production process will reduce the chip pass rate, and specific pollution problems may lead to different semiconductor device defects. It is estimated that 50% of the yield loss in the manufacturing of semiconductor components is caused by contamination with trace impurities. Therefore, how to timely and effectively control the quality of raw materials for semiconductor components is crucial.