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KDP晶体作为优质的非线性光学材料,具有脆性高、对温度敏感等特性,在单点金刚石切削(SPDT)超精密加工中,微小的温度和应力变化有可能对晶体造成损伤,但是一直未有相关实验报道。本文采用红外热成像仪对SPDT加工过程进行监测,结合Raman光谱技术,研究KDP晶体在SPDT加工前后表面温度和应力的分布变化。大尺寸KDP晶体经过快速微区切削后,在给定的切削工艺条件下,测量出切削部分最高瞬态温度比附近未切削部分高出将近8℃。通过Raman测量,显示切削后晶体表面存在残余拉应力。结合热力耦合模拟仿真,进一步分析了SPDT加工过程动态切削温度对晶体质量的影响,为优化加工参数提供依据。
KDP crystal, as a high-quality nonlinear optical material, has high brittleness and temperature sensitivity. In the ultra-precision machining of single point diamond (SPDT), slight temperature and stress changes may damage the crystal, but no Related experiment report. In this paper, infrared thermography was used to monitor the processing of SPDT. The Raman spectroscopy was used to study the surface temperature and stress distribution changes of the KDP crystal before and after the SPDT processing. After rapid micro-area cutting of large-size KDP crystals, the maximum transient temperature of the cutting part was measured to be nearly 8 ° C higher than that of the uncut parts in the vicinity under the given cutting conditions. Raman measurements show residual tensile stress on the crystal surface after cutting. Combined with thermodynamic coupling simulation, the effect of dynamic cutting temperature on the crystal quality during SPDT machining is further analyzed, which provides the basis for optimizing the machining parameters.